Standoff devices and methods of using same

ABSTRACT

A standoff device provides predetermined control of a standoff distance between electrical components mounted together with opposing conductive grid array patterns. In an embodiment, a predetermined electrical function is provided by the device to at least one of the electrical components. The standoff device comprises a plurality of rigid one-piece standoff pins which, in an embodiment, contains one or more stops which buttress against the electrical components to serve as a distancing control structure. In an embodiment, the standoff device is integral with one of the electrical components.

FIELD

The present invention is directed to standoff arrangements to controldistance and provide electrical function.

BACKGROUND

The performance requirements for semiconductor devices continue toincrease. Performance may be improved, for example, with the addition offurther input and output signal connections. To accommodate theseadditional connections in small surface mount packages, soldered gridarray technology has been used and continues to develop. As one example,Bump/Ball Grid Arrays (BGAs) have conductive bumps/balls (e.g., solderand/or conductive-filled polymer) arranged in a conductive grid arraypattern and serving as the connectors. This density is further increasedin MicroBGAs (μBGA) and Chip Scale Packages (CSPs). As advantages, thehigher density BGA reduces package size, and also helps lead todecreased printed circuit board (PCB) size, shorterleads/interconnections, reduced weight, improved electrical performance,and/or decreased cost.

With regard to gaining widespread use, both reliability of semiconductorpackages and low cost of manufacture may help promote maximized packageadoption/use. The BGA package conductive bumps/balls are the package'sinterface with the receiving substrate printed circuit board (e.g., PCB)upon which the BGA package is mounted. It has been found within researchdirected toward the present invention that the reliability of thisinterface can sometimes be affected by package standoff distance. Ifused between a PCB and a package, standoff distance may be, for example,the distance from the top plane of the PCB to the bottom edge of the BGApackage after mounting. It has been found in the present research thatthe inability to control Surface Mount Technology (SMT) assemblydeviations in standoff distance can lead to solder collapse and lowcyclic fatigue life.

In addition to physical integrity, electrical performance is anotherconsideration of conductive grid array (as well as any) mountingtechnology. More particularly, as system functions increase, packagepower demand (e.g., electrical current conduction) likewise mayincrease. Such current may be delivered through the PCB layers to thedie through some of the conductive bumps/balls, but as they becomesmaller, the conductive bumps/balls may not be able to handle a requiredelectrical current conduction capacity, or an excessive number ofconductive bumps/balls may be required to do so. Further, otherelectrical components/functions (e.g., resistors, capacitors, inductors)may be required in the area proximate to the conductive grid array,which may place limits on the conductive grid array design.

Needed are arrangements to control semiconductor package standoffdistance, and to provide convenient electrical functions.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing, and a better understanding of the present invention, willbecome apparent from the following detailed description of exampleembodiments, and the claims, when read in connection with theaccompanying drawings, all forming a part of the disclosure of thisinvention. While the foregoing, and following, written and illustrateddisclosure focuses on disclosing example embodiments of the invention,it should be clearly understood that the same is by way of illustrationand example only, and that the invention is not limited thereto. Thespirit and scope of the present invention are limited only by the termsof the appended claims.

The following represents brief descriptions of the drawings, wherein:

FIG. 1 is a side view of an example BGA package useful in explanationand understanding of background and example embodiments of the presentinvention;

FIG. 2 is a bottom view of an example substrate of FIG. 1;

FIG. 3 is a top layer view of an example PCB that will mate with theFIG. 2 substrate;

FIG. 4 is a cross-sectional side view of the PCB of FIG. 3, and furthershowing the FIGS. 1, 2 package mounted thereon in an uncontrolledstandoff arrangement;

FIG. 5 is a cross-sectional side view similar to that of FIG. 4, butwith a mounted BGA package having an advantageous arrangement of thepresent invention;

FIG. 6 is a magnified cross-sectional side view of a portion of thearrangement of FIG. 5 and illustrating an example embodiment with acountersink standoff/power pin arrangement;

FIG. 7 is a top view of a PCB similar to FIG. 3, but illustrating anexample placement of countersinks for one example embodiment of thepresent invention; and

FIG. 8 is a partial side view showing an example integratedstandoff/power pin arrangement as an alternative example embodiment ofthe present invention.

DETAILED DESCRIPTION

Before beginning a detailed description of the subject invention,mention of the following is in order. When appropriate, like referencenumerals and characters may be used to designate identical,corresponding or similar components in differing figure drawings.Further, in the detailed description to follow, examplesizes/models/values/ranges may be given, although the present inventionis not limited to the same. Well-known power/ground connections tosubstrates, ICs and other components may not be shown in great detailwithin the FIGs. for simplicity of illustration and discussion, and soas not to obscure the invention. Further, arrangements may be shown insimplistic diagram form in order to avoid obscuring the invention, andalso in view of the fact that specifics with respect to implementationof such diagram arrangements are highly dependent upon the platformwithin which the present invention is to be implemented, i.e., specificsshould be well within the purview of one skilled in the art. Wherespecific details are set forth in order to describe example embodimentsof the invention, it should be apparent to one skilled in the art thatthe invention can be practiced without, or with, variation of thesespecific details.

While the following detailed description will describe exampleembodiments of arrangements in the context of an example BGA arrangementhaving conductive bumps/balls as a conductive grid array, practice ofthe present invention is not limited to such context, i.e., practice ofthe present invention may have uses with other types of chips and withother types of mounting and packaging techniques. For example, practiceof the present invention may be able to be made in the context of theaforementioned μBGA and/or CSP arrangements.

Turning now to the detailed description, FIG. 1 relates to across-sectional view of an example BGA package useful in explanation andunderstanding of background and example embodiments of the presentinvention. More particularly, FIG. 1 illustrates a BGA package 100formed on a substrate 110 having a die 120 mounted thereto, andhermetically sealed with die attach material 130. Illustrated areconductive (e.g., gold) wires 140 for electrical interfacing fromexample power or group 1 planes 150 to die 120. The BGA package 100itself may be mounted on another substrate or PCB through conductivebumps/balls 160 on the bottom of the package. The package may becontained in an encapsulation 180.

The FIG. 1 substrate 110 may be, for example, a multi-layered/laminatedBT (Bismaleimide Triazine) laminate rigid substrate. The die 120 may be,for example, a bumped Flip Chip (FC) die joined with conductivebumps/balls and conductive pads (not shown in great detail) to thesubstrate 110, such joints forming electrical connections between thedie and the package. The die attach material 130 may be, for example, anepoxy underfill filling a gap between the die and the substrate so as toprovide mechanical support, protection for the die-to-packageinterconnects, and to maintain attachment/connection integrity despitecyclic thermal stresses (e.g., stresses resulting from a die-to-packagemismatch of coefficient of thermal expansion (CTE) and the on/offoperation of the device).

The BGA package 100 may have an example package height A of 2.0 mm (seeFIG. 1). The conductive bumps/balls 160 may be utilized in whole or inpart as electrical interconnections for signal, power and/or groundinputs/outputs to the die. The conductive bump/ball 160 height A₁ may bean example 0.635 mm. There may be, for example, multiple (e.g., two)dies 120 within a single BGA package 100, and each may be separatelyconnected with conductive (e.g., gold) wires 140 (e.g., in a stackedCSP). Such BGA package 100 is subsequently mounted to a PCB (shownhereafter in FIG. 4).

Turning next to FIG. 2, there is shown a bottom view of an exampleconductive BGA on a bottom of the FIG. 1 BGA substrate. Morespecifically, the bottom view 200 of the substrate 110 illustrates anexample layout of the substrate's bottom side BGA. An example count offifty-six conductive bumps/balls 160 is illustrated in the examplearrangement, as arranged in rows and columns. The arrangement (e.g.,number of conductive bumps/balls and grid array pattern) may vary tocorrespond to the transfer connections desired. For example, the numberof conductive bumps/balls may be variable to meet package electrical,thermal and mechanical requirements. Illustrated are example industrialdimensions with an example conductive bump/ball having an example widthb of 0.637 mm, and an example pitch e of 1.0 mm. The example packagebottom view 200 also may have a package width D of 9.5 mm, and length Eof 9.5 mm. The conductive bumps/balls 160 may be made of metal alloysuch as a eutectic tin/lead mixture (e.g., 63% Sn/37% Pb), or may be aconductive-filled polymer. Besides having assigned conductivebumps/balls utilized for predetermined electrical connections, somereserve conductive bumps/balls may be further included andunassigned/reserved for future design use.

Turning next to FIG. 3, there is shown a top view 300 of an example PCB310 which will mate with the FIG. 2 substrate's (bottom-side) BGA.Illustrated are tops of example sets of via holes 320 encircled by pads330, as well as lands 340 (composed of example conductive solder orconductive polymer and which physically connect to conductivebumps/balls of an opposing electrical component). Connective traces 350electrically join the pads 330 and lands 340. The geometry andconnectivity arrangement of pads, lands, vias, and traces may be ofvariable design.

FIG. 4 illustrates a cross-sectional side view 400 of the FIG. 3 examplePCB 310 with the FIGS. 1 and 2 BGA package 100 mounted thereon using anuncontrolled standoff arrangement. Illustrated are the lands 340 uponwhich the BGA package conductive bumps/balls 160 are mounted. Alsoillustrated are example layers 410 designated as layers L1-L6, andexample inter-layers 420 designated as inter-layers La-Le.

More particularly, the example FIG. 4 PCB shows six layers 410 withlayers L1, L3, L4, and L6, for example, for signal transfer, layer L2for power transfer, and layer L5 for grounding purposes. Each of thelayers 410 may, for example, provide a singular function (e.g., powertransfer) throughout an entirety of its layer, or may be sub-dividedinto differing areas to provide multiple differing functions (e.g.,layer L2 may be sub-divided to provide partial signal transfer andpartial power transfer functions). Signal, power and ground layers maybe constructed of copper foil, for example.

Turning next to the inter-layers 420, inter-layers La, Lc, and Le may beof, for example, prepreg material, alternating with inter-layers Lb andLd made of, for example, a copper-clad resin core. The prepreg materialmay be, for example, “pre-impregnated” fiberglass fabric saturated witha polymide, epoxy or other resin partially cured during a coatingoperation and deposited on the fabric. The core material may be copperclad resin. Vias 320 may extend in a variety of lengths/arrangements,for example, may extend totally through the PCB (see FIG. 4), extendtotally within the PCB, or connect to one side of the PCB from one ofthe inner layers.

During mounting, alignment is important in that, if the conductivebumps/balls 160 are not aligned with lands 340, the bump-/ball-to-landconnections are not reliable (e.g., they can disadvantageouslyshort-circuit with neighboring lands and/or pads). Further, lack ofco-planarity of conductive bumps/balls and lands may also inhibitreliable connections (i.e., some of the opposing conductive bumps/ballsand lands may be unable to touch due to non-planarity, thereby nevercompleting the electrical conduction path).

In the uncontrolled standoff arrangement of FIG. 4, electrical functions(e.g., power, ground and signals) may be supplied to the BGA packagefrom PCB lamination planes through the connecting vias and lands, andthen through the conductive bumps/balls 160. As disadvantages, eachconductive bump/ball (due to its limiting small size and easily meltablematerial) is limited to the amount of power (e.g., electrical currentamount) which it may carry. Use of a plurality of conductive bumps/ballsto meet a power handling demand of a single electrical function (e.g.,electrical current supply) may be a solution, but use of a plurality ofconductive bumps/balls for a single function may be unacceptable inpractice, as the number of conductive bumps/balls to be shared by allfunctions may be limited. Accordingly, electrical interfacing may belimited by ball size and quantity. Due to such limitations, note thatthe FIG. 1 example conductive (e.g., gold) wires 140 may have to be usedto provide additional connection paths.

As further disadvantages within the FIG. 4 uncontrolled standoffenvironment, there is no predictability of either conductivebump/ball-to-land alignment or standoff distance S. Turning first toalignment discussions, during assembly, the package's BGA may be placedon the receiving substrate having had solder paste applied thereto(e.g., during a surface mount assembly process). During heating/meltingand solder joint formation, cohesion between the conductive bumps/ballson the BGA and the lands may help to partially self-align to the pads onthe board by surface tension of the molten solder, and upon assemblycompletion, the solder joints may help to hold the BGA package onto thesurface of the PCB. However, the solder jointing self-alignment(cohesion) phenomena can by no means itself guarantee alignment, e.g.,if the components being mounted together are vastly misaligned duringassembly, the solder jointing alignment (cohesion) phenomena will notcorrect vast misalignment.

As further related alignment discussions, while the above-discussedconductive (e.g., gold) wires 140 may serve to improve electricalperformance, the conductive (e.g., gold) wires 140 do nothing to helpwith alignment, and in fact, are often applied at an assembly stagesubsequent to the alignment/solder-jointing stage.

Turning next to standoff variation discussions, variation in S (see FIG.4) may result in immediate yield failure, or a low cyclic fatigue lifeover time. For example, standoff variation may result in conductivebump/ball collapse during manufacture. A strong bump/ball-to-pad jointwill not occur if the conductive bump/ball collapses from the stress ofBGA mounting. Low standoff distance S can be responsible for crackingand premature failure at a package conductive bump/ball and landinterface. While larger conductive bump/ball-and-pad joints may be usedto offer more mechanical resistance to standoff variations and/orcollapse, such solution is not practical in the real world interests ofachieving smaller and smaller components and mounting arrangements.

FIG. 5 illustrates a cross-sectional side view 500 of an example(advantageous) embodiment of the present invention with standoffarrangements, e.g., standoff/power pins 510, between the BGA package 100and the PCB 310. These standoff/power pins may be separatelyprovided/installed structures, or may be integrated with the BGA, orwith the PCB component. The standoff component may be of any suitableshape or size including, foe example, the shape of the illustrated pins,bar-shaped, or alternatively rectangular or frame shaped.

The FIG. 5 example standoff/power pin maybe constructed essentially ofrigid material, and may have suitable standoffs having a predeterminedrigid standoff thickness of at least one portion thereof (e.g., stops)to buttress against and hold the BGA package at a fixed predetermined(standoff) distance from the receiving substrate. This provides animproved controlled standoff distance S′, and may help to reduce ormanage thermal/mechanical stresses which may occur to differing BGAconnections during the standard life of the product. This reduction orgreater control (e.g., uniformity) in stress due to controlled standoffcan increase the reliability of the BGA connections at the PCB/componentinterface, as stresses are distributed more equally. In one embodimentat least a portion of at least one pin of a plurality of rigid standoffpins has either a dumbbell shape or a rolling-pin share whereinprotruding portions of the dumbbell shape and the rolling-pin shapebuttress against the electrical components to serve as the distancingcontrol structure to control the standoff distance.

As to additional assembly requirements, example suitable methods/timesof adding the standoff arrangements (standoff/power pins) may includeinstallation during a SMT assembly operation, as any standoffarrangements may be held on through any solder paste. An alternativeinstallation time might be at a pick-and-place operation. In eithermethod, the standoff arrangement may be able to be held in place bysolder or other conductive material applied at a wave operation.

In addition to standoff, the example embodiment in FIG. 5 also may beused to provide another (dual) function of providing an electrical pathor function to at least one of the opposing electrical components (e.g.,the interfacing substrate and receiving substrate) of the arrangement.For example, the standoff/power pins also may be used to increaseefficient power delivery. As one example, the standoff/power pins may beattached and electrically connected to a receiving substrate's power orground layer 410 to directly provide an electrical conduction path tothe BGA package 100. The delivery of power/ground through thestandoff/power pins lessens the dependency on vias and conductivebumps/balls as a conduit for power or ground, and frees up someconductive bumps/balls for other uses. Further, at least some of theFIG. 1 conductive (e.g., gold) wires 140 may be able to be eliminated asthe standoff/electrical device (e.g., standoff/power pin) arrangementcan be used as an electrical conduction path instead. As anotherembodiment, the pin can be arranged to provide an electrical path withrespect to only one of the substrates. For example, the pin may providean electrical path from one electrical plane to a differing electricalplane within the same substrate. With the FIG. 5 embodiment helping toimprove routing of power and signals, a side advantage is that the PCBlayers may be able to be better optimized for cost and performance.

Since a weight/assembly pressure of the BGA package may now be borne bythe standoff/power pins rather than the conductive bumps/balls, smallerconductive bumps/balls may be able to be used so as to achieve a gridarray of increased density within a same-size grid array. Alternatively,an existing grid array could be made smaller to enable a smaller packagesize, allowing for construction of smaller electrical devices. The FIG.5 example embodiment standoff/power pin may be alternatively applicableto other devices that have reduced control of standoff distance, such asmulti-chip modules.

FIG. 6 illustrates a magnified cross-sectional view 600 of an examplestandoff/power pin 510 between receiving substrate 310 and BGA package100. An example standoff/power pin may be constructed of a rigid,electrically conductive material, and may be formed, for example,through any standard mold, stamp, etch, extrude and depositmanufacturing processes. The standoff/power pin should be capable ofwithstanding temperatures of at least the assembly process and a normalelectrical package operation.

The illustrated standoff/power pin structure has example platforms(shelves) 610 which, when the standoff/power pins are positioned incountersinks 620 in the BGA package 100 and in the receiving substrate310, buttress against such components so as to control the standoffdistance of the BGA package in relation to the receiving substrate. Whenthe package is assembled, the mounted rigid standoff/power pin willenable a standoff distance S′ between the BGA package and the receivingsubstrate to be controlled dependent on the distance between theplatforms (shelves) 610, and the depth of the countersinks 620.Alternatively, the countersinks may be absent and the platforms(shelves) could rest on, and be attached to, a package surface. Inanother embodiment, one or more platforms (shelves) may be absent, withthe standoff distance determined by the length of the standoff/power pinstructure relative to the standoff/power pin mounting depth.

As mentioned previously, the standoff/power pin may be constructed of amaterial that will allow the standoff/power pin to also performelectrical functions, e.g., serve as an electrical conduction path fromthe receiving substrate layers to the BGA package. The standoff/powerpin may be of a solid material in monolithic construction, oralternatively, may be of a more complex multi-layered construction suchas having differing conductive surfaces 630 and insulated surfaces 640.Power delivery from the receiving substrate 310 to the BGA package 100may be improved as the conductive surface 630 of each standoff/power pinmay be designed to directly contact an example PCB power layer 410′ andan example power plane 150 when the standoff/power pin is installed uponmounting. Alternatively, the standoff/power pin may be designed tocontact a receiving substrate's ground layer and receiving substrate'sground plane.

FIG. 7 is top view 700 of a receiving substrate 310 similar to FIG. 3,but showing an example placement of countersinks 620 for thestandoff/power pins. In the example embodiment, the receiving substrateand BGA have through-holes 650 (see FIG. 6) matched for standoff/powerpin placement. Such through-holes can, with proper planning and design,be used to greatly improve alignment of the conductive grid arraycomponents of the opposing receiving substrate and BGA during theassembly/mounting processes. Practice of the present invention is notlimited to the FIG. 7 arrangement in that, for example, thestandoff/power pin placement may have alternative geometries foralignment of different packages, with alternative numbers of thestandoff/power pins. Further, the standoff/power pin may havealternative multiple extensions of varying length, allowing contact withvaried receiving substrate layers and BGA planes (lamination layers)with varied electrical connections. In other example embodiments, thepresent invention shape may be of varied geometries (e.g., rectangular)to facilitate alternate arrangements for contact with receivingsubstrate layers and BGA planes.

FIG. 8 illustrates another example embodiment of a standoff/power pinarrangement 810 which is monolithic, or integrated, with the receivingsubstrate 310 structure, and layer 410″. Alternatively, thestandoff/power pin may be monolithic, or integrated, with the BGAstructure. To lower manufacturing costs, an integrated structure mayincorporate the standoff/power pin without countersinks.

As a further embodiment, rather than providing simple electricalconduction path functions, the standoff/power pins may be able to bedesigned to provide other types of electrical functions to one or bothof the electrical components being mounted together. In a simplisticexample, the standoff/power pin may be constructed of a rigid butelectrically resistive material, to result in a tubular resistor.Continuing with another example, the standoff/power pin could be of amore complex, multi-layered construction having conductive materialinner and outer layers separated by an intermediate dielectric materiallayer, to result in a tubular capacitor. More particularly, an outerconductive layer of the standoff/power pin may serve as a first plate ofthe capacitor, while an inner conductive layer may serve as a secondplate of the capacitor, with an insulating or dielectric layer beingdisposed therebetween. In this example embodiment, the standoff/powerpin could serve a double function, both in control of standoff distanceand as a capacitance device. Such dual standoff/capacitance arrangementmay be particularly useful with dies, packages, etc. requiringdecoupling capacitors.

It should be noted that, in such a situation, the capacitive-typestandoff/power pin may be providing an electrical function solely to asingle substrate rather than electrically interfacing the twosubstrates. As one example, the capacitive device could serve as anelectrical path/device for one of the substrates in that the innerconductive layer and the outer conductive layer could be electricallyconnected to the same substrate, while the capacitive device iselectrically insulated from the other substrate. However, thestandoff/power pin would still provide physical interfacing bycontacting both substrates to control the standoff distance. As yetanother example, the standoff/power pin may be formed into a tubularinductor, or may be of an even more complex construction containing onesof resistors, capacitors and inductors, to result in, for example, acomplex impedance arrangement, an electronic filter arrangement, and soforth.

In conclusion, reference in the specification to “one embodiment”, “anembodiment”, “example embodiment”, etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to affect such feature, structure, orcharacteristic in connection with other embodiments. Furthermore, forease of understanding, certain method procedures may have beendelineated as separate procedures; however, these separately delineatedprocedures should not be construed as necessarily order dependent intheir performance, i.e., some procedures may be able to be performed inan alternative ordering, simultaneously, and so forth.

This concludes the description of the example embodiments. Although thepresent invention has been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis invention. More particularly, reasonable variations andmodifications are possible in the component parts and/or arrangements ofthe subject combination arrangement within the scope of the foregoingdisclosure, the drawings and the appended claims without departing fromthe spirit of the invention. In addition to variations and modificationsin the component parts and/or arrangements, alternative uses will alsobe apparent to those skilled in the art.

While the foregoing example embodiments illustrate using the standoffarrangements of the present invention to provide dual standoff controland electrical function between a package and another substrate,practice of alternative embodiments of the present invention may alsohave uses providing dual standoff control and electrical functionbetween other types of items. This includes, for example, providingstandoff/electrical-functions between stacked dies, between a die and asubstrate, and so forth. Further, the standoff arrangements are notlimited to standoff/power pins, or to arrangements that penetrate thecomponents (e.g., substrates) to which it provides the standoff orelectrical function. Finally, practice of the various embodiments of thepresent invention is not limited to arrangements providing the standoffand electrical functions equal to one another. For example, anembodiment may have standoff/electrical-function arrangements in whichstandoff/power pins have a primary purpose of power delivery, and alesser function of standoff distance control, or vice versa.

1. A standoff/electrical device comprising: a standoff devicearrangement to provide predetermined control of a standoff distancebetween electrical components mounted together with opposing conductivegrid array patterns, wherein the standoff device arrangement comprises aplurality of rigid one-piece standoff pins; and an electrical functionstructure to provide a predetermined electrical function to at least oneof the electrical components.
 2. The standoff/electrical device of claim1, wherein the plurality of rigid one-piece standoff pins have a matingrelationship with at least one of the electrical components and adistancing control structure to control the standoff distance, with atleast a sub-plurality of the plurality of rigid one-piece standoff pinshaving the electrical function structure.
 3. The standoff/electricaldevice of claim 2, wherein the distancing control structure comprisesone or more stops on at least one pin of the plurality of rigidone-piece standoff pins which buttress against the electricalcomponents.
 4. The standoff/electrical device of claim 1, wherein thepredetermined electrical function is selected from the group consistingof an electrical conduction path function, a resistor function, acapacitor function, an inductor function, and any combination thereof.5. The standoff/electrical device of claim 1, wherein at least one ofthe electrical components is a printed circuit board (PCB), furtherwherein the conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid, array, a pad grid array, and any combination thereof.
 6. Thestandoff/electrical device of claim 1, wherein the standoff/electricaldevice is composed either substantially entirely ofelectrical-conductive material or constructed to have at least twodiffering areas composed of a material selected from the groupconsisting of electrical-conductive material, electrical-resistivematerial, electrical-insulative material, electrical-dielectricmaterial, electrical-inductor material, and any combination thereof. 7.The standoff/electrical device of claim 1, wherein thestandoff/electrical device is provided integrally as part of one of theelectrical components.
 8. The standoff/electrical device of claim 1,wherein the standoff/electrical device comprises alignment structure tosubstantially align the opposing conductive grid array patterns of theelectrical components during mounting together thereof.
 9. Mountedcomponents comprising: at least two electrical components havingopposing conductive grid array patterns for electrical connectionthereof; a standoff device to provide predetermined control of astandoff distance between electrical components mounted together withopposing conductive grid array patterns, wherein the standoff devicecomprises a plurality of rigid one-piece standoff pins; and anelectrical function structure to provide a predetermined electricalfunction to at least one of the electrical components.
 10. The mountedcomponents of claim 9, wherein the plurality of rigid one-piece standoffpins have a mating relationship with at least one of the electricalcomponents and a distancing control structure to control the standoffdistance, with at least a sub-plurality of the plurality of rigidone-piece standoff pins having the electrical function structure. 11.The mounted components of claim 10, wherein the distancing controlstructure comprises one or more stops on at least one pin of theplurality of rigid one-piece standoff pins which buttress against theelectrical components.
 12. The mounted components of claim 9, whereinthe predetermined electrical function is selected from the groupconsisting of an electrical conduction path function, a resistorfunction, a capacitor function, an inductor function, and anycombination thereof.
 13. The mounted components of claim 9, wherein atleast one of the electrical components is a printed circuit board (PCB),further wherein the conductive grid array patterns are selected from thegroup consisting of a bump/ball grid array (BGA), a micro BGA (μBGA), aland grid, a pad grid array, and any combination thereof.
 14. Themounted components of claim 9, wherein the electrical function structureis composed either substantially entirely of electrical-conductivematerial or constructed to have at least two differing areas composed ofa material selected from the group consisting of electrical-conductivematerial, electrical-resistive material, electrical-insulative material,electrical-dielectric material, electrical-inductor material, and anycombination thereof.
 15. The mounted components of claim 9, wherein thestandoff device is provided integrally as part of one of the electricalcomponents.
 16. The mounted components of claim 9, wherein the standoffdevice comprises alignment structure to substantially align the opposingconductive grid array patterns of the electrical components duringmounting together thereof.
 17. A components-mounting method comprising:mounting at least two electrical components having opposing conductivegrid array patterns for electrical connection thereof; and interposing astandoff device to provide predetermined control of a standoff distancebetween the at least two electrical components mounted together withopposing conductive grid array patterns, wherein the standoff devicecomprises a plurality of rigid one-piece standoff pins; and providing anelectrical function structure to provide a predetermined electricalfunction to at least one of the electrical components.
 18. The method ofclaim 17, wherein the plurality of rigid one-piece standoff pins have amating relationship with at least one of the electrical components and adistancing control structure to control the standoff distance, with atleast a sub-plurality of the plurality of rigid one-piece standoff pinshaving the electrical function structure.
 19. The method of claim 18,wherein the distancing control structure comprises one or more stops onat least one pin of the plurality of rigid one-piece standoff pins whichbuttress against the electrical components.
 20. The method of claim 17,wherein the predetermined electrical function is selected from the groupconsisting of an electrical conduction path function, a resistorfunction, a capacitor function, an inductor function, and anycombination thereof.
 21. The method of claim 17, wherein at least one ofthe electrical components is a printed circuit board (PCB), furtherwherein the conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid array, a pad grid array, and any combination thereof.
 22. Themethod of claim 17, wherein the standoff device is composed eithersubstantially entirely of electrical-conductive material or constructedto have at least two differing areas composed of a material selectedfrom the group consisting of electrical-conductive material,electrical-resistive material, electrical-insulative material,electrical-dielectric material, electrical-inductor material, and anycombination thereof.
 23. The method of claim 17, comprising providingthe standoff device integrally as part of one of the electricalcomponents.
 24. The method claim of claim 17, comprising providing thestandoff device with alignment structure to substantially align theopposing conductive grid array patterns of the electrical componentsduring mounting together thereof.
 25. A standoff/electrical devicecomprising a standoff member having a predetermined rigid standoffthickness and disposable between electrical components mounted togetherwith opposing conductive grid array patterns to maintain a predetermineddistance therebetween, wherein the standoff member comprises a pluralityof grid one-piece standoff pins, the standoff member having anelectrical path electrically connectable to at least one of theelectrical components.
 26. The standoff/electrical device of claim 25,wherein the plurality of rigid one-piece standoff pins have a matingrelationship with at least one of the electrical components, with atleast a sub-plurality of the plurality of rigid one-piece standoff pinshaving the electrical path.
 27. The standoff/electrical device of claim26, wherein the predetermined rigid standoff thickness comprises one ormore stops on at least one pin of the plurality of rigid one-piecestandoff pins which buttress against the electrical components.
 28. Thestandoff/electrical device of claim 25, wherein the electrical path isselected from the group consisting of a substantially non-resistiveelectrical path, a resistive electrical path, a capacitive electricalpath, an inductive electrical path, and any combination thereof.
 29. Thestandoff/electrical device of claim 25, wherein at least one of theelectrical components is a printed circuit board (PCB), further whereinthe conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid array, a pad grid array, and any combination thereof.
 30. Thestandoff/electrical device of claim 25, wherein the standoff/electricaldevice is composed either substantially entirely ofelectrical-conductive material or constructed to have at least twodiffering areas composed of a material selected from the groupconsisting of electrical-conductive material, electrical-resistivematerial, electrical-insulative material, electrical-dielectricmaterial, electrical-inductor material, and any combination thereof. 31.The standoff/electrical device of claim 25, wherein thestandoff/electrical device is provided integrally as part of one of theelectrical components.
 32. The standoff/electrical device of claim 25,wherein the standoff/electrical device comprises a first aligner ofpredetermined shape engageable with a second aligner on at least one ofthe electrical components to substantially align the opposing conductivegrid array patterns of the electrical components during mountingtogether thereof.
 33. Mounted components comprising: at least twoelectrical components having opposing conductive grid array patterns forelectrical connection thereof; and a standoff/electrical deviceincluding a standoff member having a predetermined rigid standoffthickness and disposable between the at least two electrical componentsmounted together with the opposing conductive grid array patterns tomaintain a predetermined distance therebetween, wherein the standoffmember comprises a plurality of rigid one-piece standoff pins, thestandoff member having an electrical path electrically connectable to atleast one of the at least two electrical components.
 34. The mountedcomponents of claim 33, wherein the plurality of rigid one-piecestandoff pins have a mating relationship with at least one of the atleast two electrical components, with at least a sub-plurality of theplurality of rigid one-piece standoff pins having the electrical path.35. The mounted components of claim 34, wherein the predetermined rigidstandoff thickness comprises one or more stops on at least one pin ofthe plurality of rigid one-piece standoff pins which buttress againstthe electrical components.
 36. The mounted components of claim 33,wherein the electrical path is selected from the group consisting of asubstantially non-resistive electrical path, a resistive electricalpath, a capacitive electrical path, an inductive electrical path, andany combination thereof.
 37. The mounted components of claim 33, whereinat least one of the at least two electrical components is a printedcircuit board (PCB), and wherein the conductive grid array patterns areselected from the group consisting of a bump/ball grid array (BGA), amicro BGA (μBGA), a land grid array, a pad grid array, and anycombination thereof.
 38. The mounted components of claim 33, wherein thestandoff/electrical device is composed either substantially entirely ofelectrical-conductive material or constructed to have at least twodiffering areas composed of a material selected from the groupconsisting of electrical-conductive material, electrical-resistivematerial, electrical-insulative material, electrical-dielectricmaterial, electrical-inductive material, and any combination thereof.39. The mounted components of claim 33, wherein the standoff/electricaldevice is provided integrally as part of one of the electricalcomponents.
 40. The mounted components of claim 33, where thestandoff/electrical device comprises a first aligner of predeterminedshape engageable with a second aligner on at least one of the at leasttwo electrical components to substantially align the opposing conductivegrid array patterns of the at least two electrical components duringmounting together thereof.
 41. A standoff/electrical device comprising:a standoff device to provide predetermined control of a standoffdistance between electrical components mounted together with opposingconductive grid array patterns, wherein the standoff device comprises aplurality of rigid one-piece standoff pins having a mating relationshipwith at least one of the electrical components and a distancing controlstructure to control the standoff distance, wherein the distancingcontrol structure comprises one or more stops on at least one pin of theplurality of rigid one-piece standoff pins which buttress against theelectrical components; and an electrical function structure to provide apredetermined electrical function to at least one of the electricalcomponents, wherein at least a sub-plurality of the plurality of rigidone-piece standoff pins have the electrical function structure.
 42. Thedevice of claim 41 wherein at least a portion of the at least one pinhas a dumbbell shape or a rolling-pin shape.
 43. The device of claim 41,wherein the predetermined electrical function is selected from the groupconsisting of an electrical conduction path function, a resistorfunction, a capacitor function, an inductor function, and anycombination thereof.
 44. The device of claim 41 wherein at least one ofthe electrical components is a printed circuit board (PCB), furtherwherein the conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid array, a pad grid array, and any combination thereof.
 45. Mountedcomponents comprising: at least two electrical components havingopposing conductive grid array patterns for electrical connectionthereof; a standoff device to provide predetermined control of astandoff distance between electrical components mounted together withopposing conductive grid array patterns wherein the standoff devicearrangement comprises a plurality of rigid one-piece standoff pinshaving a mating relationship with at least one of the electricalcomponents and a distancing control structure to control the standoffdistance, wherein the distancing control structure comprises one or morestops on at least one pin of the plurality of rigid one-piece standoffpins which buttress against the electrical components; and an electricalfunction structure to provide a predetermined electrical function to atleast one of the electrical components, wherein at least a sub-pluralityof the plurality of rigid one-piece standoff pins have the electricalfunction structure.
 46. The components of claim 45 wherein at least aportion of the at least one pin has a dumbbell shape or a rolling-pinshape.
 47. The components of claim 45, wherein the predeterminedelectrical function is selected from the group consisting of anelectrical conduction path function, a resistor function, a capacitorfunction, an inductor function, and any combination thereof.
 48. Thecomponents of claim 45 wherein at least one of the electrical componentsis a printed circuit board (PCB), further wherein the conductive gridarray patterns are selected from the group consisting of a bump/ballgrid array (BGA), a micro BGA (μBGA), a land grid array, a pad gridarray, and any combination thereof.
 49. A components-mounting methodcomprising: mounting at least two electrical components having opposingconductive grid array patterns for electrical connection thereof;interposing a standoff device to provide predetermined control of astandoff distance between the at least two electrical components mountedtogether with opposing conductive grid array patterns, wherein thestandoff device comprises a plurality of rigid one-piece standoff pinshaving a mating relationship with at least one of the electricalcomponents and a distancing control structure to control the standoffdistance, wherein the distancing control structure comprises one or morestops on at least one pin of the plurality of rigid one-piece standoffpins which buttress against the electrical components; and providing anelectrical function structure to provide a predetermined electricalfunction to at least one of the electrical components, wherein at leasta sub-plurality of the plurality of rigid one-piece standoff pins havethe electrical function structure.
 50. The components of claim 49wherein at least a portion of the at least one pin has a dumbbell shapeor a rolling-pin shape.
 51. The method of claim 49, wherein thepredetermined electrical function is selected from the group consistingof an electrical conduction path function, a resistor function, acapacitor function, an inductor function, and any combination thereof.52. The method of claim 49 wherein at least one of the electricalcomponents is a printed circuit board (PCB), further wherein theconductive grid array patterns are selected from the group consisting ofa bump/ball grid array (BGA), a micro BGA (μBGA), a land grid array, apad grid array, and any combination thereof.
 53. A standoff/electricaldevice comprising a standoff member having a predetermined rigidstandoff thickness and disposable between electrical components mountedtogether with opposing conductive grid array patterns to maintain apredetermined distance therebetween, the standoff member having anelectrical path electrically connectable to at least one of theelectrical components wherein the standoff member comprises a pluralityof rigid one-piece standoff pins having a mating relationship with atleast one of the electrical components, with at least a sub-plurality ofthe plurality of rigid one-piece standoff pins having the electricalpath, wherein the predetermined rigid standoff thickness comprises oneor more stops on at least one pin of the plurality of rigid one-piecestandoff pins which buttress against the electrical components.
 54. Thedevice of claim 53 wherein at least a portion of the at least one pinhas a dumbbell shape or a rolling-pin shape.
 55. The device of claim 53wherein the predetermined electrical function is selected from the groupconsisting of an electrical conduction path function, a resistorfunction, a capacitor function, an inductor function, and anycombination thereof.
 56. The device of claim 53 wherein at least one ofthe electrical components is a printed circuit board (PCB), furtherwherein the conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid array, a pad grid array, and any combination thereof.
 57. Mountedcomponents comprising: at least two electrical components havingopposing conductive grid array patterns for electrical connectionthereof; and a standoff/electrical device including a standoff memberhaving a predetermined rigid standoff thickness and disposable betweenthe at least two electrical components mounted together with theopposing conductive grid array patterns to maintain a predetermineddistance therebetween, the standoff member having an electrical pathelectrically connectable to at least one of the at least two electricalcomponents wherein the standoff member comprises a plurality of rigidone-piece standoff pins having a mating relationship with at least oneof the at least two electrical components, with at least a sub-pluralityof the plurality of rigid one-piece standoff pins having the electricalpath, wherein the predetermined rigid standoff thickness comprises oneor more stops on at least one pin of the plurality of rigid one-piecestandoff pins which buttress against the electrical components.
 58. Thedevice of claim 57 wherein at least a portion of the at least one pinhas a dumbbell shape or a rolling-pin shape.
 59. The mounted componentsof claim 57 wherein the predetermined electrical function is selectedfrom the group consisting of an electrical conduction path function, aresistor function, a capacitor function, an inductor function, and anycombination thereof.
 60. The mounted components of claim 57 wherein atleast one of the electrical components is a printed circuit board (PCB),further wherein the conductive grid array patterns are selected from thegroup consisting of a bump/ball grid array (BGA), a micro BGA (μBGA), aland grid array, a pad grid array, and any combination thereof.
 61. Astandoff/electrical device comprising: a standoff device to providepredetermined control of a standoff distance between electricalcomponents mourned together with opposing conductive grid array patternswherein the standoff device comprises a plurality of rigid one-piecestandoff pins having a mating relationship with at least one of theelectrical components and a distancing control structure to control thestandoff distance, wherein the standoff device is provided integrally aspart of one of the electrical components; and an electrical functionstructure to provide a predetermined electrical function to at least oneof the electrical components, wherein at least a sub-plurality of theplurality of rigid one-piece standoff pins have the electrical functionstructure to provide the electrical function.
 62. The device of claim 61wherein the predetermined electrical function is selected from the groupconsisting of an electrical conduction path function, a resistorfunction, a capacitor function, an inductor function, and anycombination thereof.
 63. The device of claim 61 wherein at least one ofthe electrical components is a printed circuit board (PCB), furtherwherein the conductive grid array patterns are selected from the groupconsisting of a bump/ball grid array (BGA), a micro BGA (μBGA), a landgrid array, a pad grid array, and any combination thereof.